发明名称 |
Semiconductor chip package including voltage generation circuit with reduced power noise |
摘要 |
A semiconductor chip package eliminates and minimizes a power noise generated from a voltage generation circuit in the semiconductor chip package includes an integrated circuit chip with a voltage generation circuit that receives an external voltage to generate a supply voltage to be used in an internal circuit and a connection terminal connected to an output node of the voltage generation circuit, and a mounting substrate including a noise eliminator electrically connected to the connection terminal to reduce a power noise of the supply voltage and a mounting substrate to mount the integrated circuit chip to package the integrated circuit chip as the semiconductor chip package. |
申请公布号 |
US8933747(B2) |
申请公布日期 |
2015.01.13 |
申请号 |
US201213617802 |
申请日期 |
2012.09.14 |
申请人 |
SAMSUNG Electronics Co., Ltd. |
发明人 |
Kang SunWon;Kim Chiwook;Woo Hyun jeong;Hwang Sangjoon |
分类号 |
G11C5/14;G05F3/00;H02M1/14;H01L23/64;G11C11/4074 |
主分类号 |
G11C5/14 |
代理机构 |
Ellsworth IP Group PLLC |
代理人 |
Ellsworth IP Group PLLC |
主权项 |
1. A semiconductor chip package comprising:
an integrated circuit chip including a voltage generation circuit that receives an external voltage to generate a supply voltage greater than the external voltage to be used in an internal circuit and a connection terminal connected to an output node of the voltage generation circuit; and a mounting substrate including a noise eliminator electrically connected to the connection terminal to reduce a power noise of the supply voltage and to mount the integrated circuit chip to package the integrated circuit chip as the semiconductor chip package. |
地址 |
Suwon-si KR |