发明名称 Methods of patterning a conductor on a substrate
摘要 A method of patterning a conductor on a substrate includes providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features. Then the raised features of the inked stamp contact a metal-coated visible light transparent substrate. Then the metal is etched to form an electrically conductive micropattern corresponding to the raised features of the inked stamp on the visible light transparent substrate.
申请公布号 US8932475(B2) 申请公布日期 2015.01.13
申请号 US201313848162 申请日期 2013.03.21
申请人 3M Innovative Properties Company 发明人 Zu Lijun;Frey Matthew H.
分类号 B44C1/22;H05K3/00;B82Y10/00;B82Y40/00;G03F7/00;G06F3/044;H05K3/06 主分类号 B44C1/22
代理机构 代理人 Moshrefzadeh Robert S.
主权项 1. A method of patterning a conductor on a substrate, comprising: providing an inked elastomeric stamp inked with self-assembled monolayer-forming molecules and having a relief pattern with raised features, the relief pattern having a low density region with a fill factor between 0.5% and 20%, measuring at least 5 square millimeters comprising: a two-dimensional mesh of raised linear features having an average area density value of raised features between 0.5% to 20%, wherein the raised linear features have a width value between 0.5 to 25 micrometers;a distance value between adjacent raised linear features of less than 1 millimeter; the relief pattern further having a raised feature measuring at least 50 micrometers in width, wherein for a junction formed between the raised linear features and a larger raised feature, the raised linear feature width is widened by tapering before making contact to the larger raised feature; contacting the raised linear features of the inked elastomeric stamp to a metal-coated visible light transparent substrate; and etching the metal to form an electrically conductive micropattern corresponding to the raised features of the inked elastomeric stamp on the visible light transparent substrate.
地址 St. Paul MN US