| 发明名称 |
Monitoring incident beam position in a wafer inspection system |
| 摘要 |
Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction. |
| 申请公布号 |
US8934091(B2) |
申请公布日期 |
2015.01.13 |
| 申请号 |
US201313794030 |
申请日期 |
2013.03.11 |
| 申请人 |
KLA-Tencor Corp. |
发明人 |
Reich Juergen;Petrenko Aleksey;Fong Richard;Whiteside Bret;Cao Jien;Wolters Christian;Romanovsky Anatoly;Kavaldjiev Daniel |
| 分类号 |
G01J1/00;H01L21/67;G01J1/42 |
主分类号 |
G01J1/00 |
| 代理机构 |
|
代理人 |
Mewherter Ann Marie |
| 主权项 |
1. A structure configured for monitoring incident beam position in a wafer inspection system, comprising:
a chuck configured to support a wafer during inspection by the wafer inspection system, wherein the chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection; and a feature formed in the chuck, wherein an axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction. |
| 地址 |
Milpitas CA US |
