| 摘要 |
The present invention relates to a power semiconductor module having a latchable lead member. The present invention includes first semiconductor devices which are mounted on a substrate which has latch holes; and stepped lead members which have a latch protrusion which is inserted into the latch hole to be fixed, and electrically connect the substrate and the first semiconductor devices. According to the present invention, the bonding area and bonding strength of the semiconductor device are increased by using a latchable lead member, thereby, improving reliability. Also, the bonding area and bonding strength of the semiconductor device are increased by forming the latchable lead member with a step shape, thereby improving the problem of reliability. Also, processes can be improved by controlling a step difference according to the height of the semiconductor device and the alignment of the semiconductor device and failure can be reduced. Process time can be reduced by removing a wire bonding process. |
