| 发明名称 |
Induction bonding |
| 摘要 |
The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components. |
| 申请公布号 |
US8931684(B2) |
申请公布日期 |
2015.01.13 |
| 申请号 |
US201414200745 |
申请日期 |
2014.03.07 |
| 申请人 |
|
发明人 |
Nikkhoo Michael;Salehi Amir |
| 分类号 |
B23K31/02;B23K1/002;H01R43/02;H05K13/00;B23K3/00;H05K3/34;H01R12/53 |
主分类号 |
B23K31/02 |
| 代理机构 |
Womble Carlyle Sandridge & Rice, LLP |
代理人 |
Womble Carlyle Sandridge & Rice, LLP |
| 主权项 |
1. A method for bonding a plurality of wires to a metal substrate disposed along a top surface of a printed circuit board (PCB), the method comprising:
placing the plurality of wires upon the metal substrate; applying inductive energy to solder the plurality of wires to the metal substrate; monitoring a temperature of a portion of the PCB; and varying an amount of inductive energy applied to the plurality of wires in accordance with a temperature of the monitored portion of the PCB. |
| 地址 |
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