Semiconductor device having stick drivers and a method of manufacturing the same

摘要

A pixel TFT formed in a pixel region is formed on a first substrate by a channel etch type reverse stagger type TFT, and patterning of a source region and a drain region, and patterning of a pixel electrode are performed by the same photomask. A driver circuit formed by using TFTs having a crystalline semiconductor layer, and an input-output terminal dependent on the driver circuit, are taken as one unit. A plurality of units are formed on a third substrate, and afterward the third substrate is partitioned into individual units, and the obtained stick drivers are mounted on the first substrate.

主权项

1. A semiconductor device comprising:
a first gate wiring on an insulating surface; a second gate wiring on the insulating surface, wherein the second gate wiring extends in parallel with the first gate wiring; a gate electrode on the insulating surface, the gate electrode being in electrical contact with the first gate wiring; an insulating film over the first gate wiring and the gate electrode; a semiconductor film over the insulating film, the semiconductor film including a channel forming region which overlaps with the gate electrode with the insulating film therebetween; a source wiring over the semiconductor film, the source wiring being in electrical contact with the channel forming region, wherein the source wiring intersects the first gate wiring and the second gate wiring; a drain electrode over the semiconductor film, the drain electrode being in electrical contact with the channel forming region; a transparent pixel electrode in electrical contact with the drain electrode; and a transparent conductive layer formed of a same material as the transparent pixel electrode, wherein a portion of the semiconductor film is present at an intersection between the source wiring and the first gate wiring, wherein the transparent conductive layer does not overlap with the transparent pixel electrode. wherein the transparent conductive layer overlaps with the source wiring at least partly, wherein the transparent conductive layer extends beyond both side edges of the source wiring, and wherein at least a portion of the transparent conductive layer is located between the first gate wiring and the second gate wiring.