Data transmission through optical vias

摘要

Technologies generally described herein relate to multilayer circuit boards with optical vias for data transmission between the layers. One or more regions may be created on a multilayer circuit board for optical vias. A transparent conducting oxide (TCO) layer can be deposited on a top and/or bottom layer of the circuit board. P-N junctions can be created over the TCO layer about the one or more regions to form optical vias as photo-emitting and/or photo-detecting components. The photo-emitting and/or photo-detecting components may be coupled to electronic components on the multilayer circuit board.

主权项

1. A multilayer circuit board configured to support optical communication between layers of the multilayer circuit board, the multilayer circuit board comprising:
a first layer that includes a first surface; a second layer that includes a second surface and that is distanced from the first layer by a dielectric layer; an optical via that runs between the first surface of the first layer and the second surface of the second layer, the optical via including a first end at the first surface of the first layer and a second end at the second surface of the second layer; a first transparent conductive oxide (TCO) layer formed on the first surface of the first layer and implanted with impurities so as to form a photo-emitter component at the first end of the optical via; and a second TCO layer formed on the second surface of the second layer and implanted with impurities so as to form a photo-detector component at the second end of the optical via.