发明名称 |
DEVICE AND METHOD FOR DETACHING A SEMICONDUCTOR WAFER FROM A SUBSTRATE |
摘要 |
The device is provided with a film with an adhesive layer (3s) to accommodate the product substrate in a contacting surface section (3k) of the film. The film is mounted in a mounting section (3b) encasing the contacting surface section. A separating section (3a) is placed between the contacting surface section and the mounting section. An independent claim is also included for a method for separating a product substrate from a carrier substrate. |
申请公布号 |
KR20150004898(A) |
申请公布日期 |
2015.01.13 |
申请号 |
KR20147033331 |
申请日期 |
2010.08.20 |
申请人 |
EV GROUP GMBH |
发明人 |
LINDNER FRIEDRICH PAUL;BURGGRAF JURGEN |
分类号 |
H01L21/683;H01L21/301;H01L21/50;H01L21/677 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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