发明名称 |
Self-aligned gate electrode diffusion barriers |
摘要 |
A self-aligned diffusion barrier may be formed by forming a first masking layer, having a vertical sidewall on a semiconductor layer, above a first portion of the semiconductor layer. A first spacer layer, including a spacer region on the vertical sidewall, may be formed above the semiconductor layer. A second portion of the semiconductor layer not covered by the first masking layer or the spacer region may then be doped. A second masking layer may then be formed over the first spacer layer and planarized to expose at least a portion of the spacer region. The spacer region may then be etched to form a notch exposing a third portion of the semiconductor layer. The third portion may then be doped with a barrier dopant. The first masking layer may be removed and a second spacer layer filling the notch may be formed. The first portion may then be doped. |
申请公布号 |
US8932920(B2) |
申请公布日期 |
2015.01.13 |
申请号 |
US201313904060 |
申请日期 |
2013.05.29 |
申请人 |
International Business Machines Corporation |
发明人 |
Ellis-Monaghan John J.;Gambino Jeffrey P.;Herrin Russell T.;Schutz Laura J.;Shank Steven M. |
分类号 |
H01L21/8238;H01L27/092 |
主分类号 |
H01L21/8238 |
代理机构 |
|
代理人 |
Lestrange Michael;Kelly L. Jeffrey |
主权项 |
1. A method of forming a self-aligned diffusion barrier between a first doped region and a second doped region, the method comprising:
forming a first masking layer above a first portion of a semiconductor layer, wherein the first masking layer comprises an end having a vertical sidewall; forming a first spacer layer above the semiconductor layer and the first masking layer, wherein the spacer layer comprises a spacer region on the vertical sidewall; doping a second portion of the semiconductor layer not covered by the first masking layer and not covered by the spacer region; forming a second masking layer over the first spacer layer; planarizing the second masking layer to expose at least a portion of the spacer region; etching the exposed portion of the spacer region to form a notch exposing a third portion of the semiconductor layer between the first portion and the second portion; doping the third portion of the semiconductor layer with a barrier dopant; removing the first masking layer; forming a second spacer layer over the second masking layer, wherein the second spacer layer fills the notch; and doping the first portion of the semiconductor layer. |
地址 |
Armonk NY US |