发明名称 Self-aligned gate electrode diffusion barriers
摘要 A self-aligned diffusion barrier may be formed by forming a first masking layer, having a vertical sidewall on a semiconductor layer, above a first portion of the semiconductor layer. A first spacer layer, including a spacer region on the vertical sidewall, may be formed above the semiconductor layer. A second portion of the semiconductor layer not covered by the first masking layer or the spacer region may then be doped. A second masking layer may then be formed over the first spacer layer and planarized to expose at least a portion of the spacer region. The spacer region may then be etched to form a notch exposing a third portion of the semiconductor layer. The third portion may then be doped with a barrier dopant. The first masking layer may be removed and a second spacer layer filling the notch may be formed. The first portion may then be doped.
申请公布号 US8932920(B2) 申请公布日期 2015.01.13
申请号 US201313904060 申请日期 2013.05.29
申请人 International Business Machines Corporation 发明人 Ellis-Monaghan John J.;Gambino Jeffrey P.;Herrin Russell T.;Schutz Laura J.;Shank Steven M.
分类号 H01L21/8238;H01L27/092 主分类号 H01L21/8238
代理机构 代理人 Lestrange Michael;Kelly L. Jeffrey
主权项 1. A method of forming a self-aligned diffusion barrier between a first doped region and a second doped region, the method comprising: forming a first masking layer above a first portion of a semiconductor layer, wherein the first masking layer comprises an end having a vertical sidewall; forming a first spacer layer above the semiconductor layer and the first masking layer, wherein the spacer layer comprises a spacer region on the vertical sidewall; doping a second portion of the semiconductor layer not covered by the first masking layer and not covered by the spacer region; forming a second masking layer over the first spacer layer; planarizing the second masking layer to expose at least a portion of the spacer region; etching the exposed portion of the spacer region to form a notch exposing a third portion of the semiconductor layer between the first portion and the second portion; doping the third portion of the semiconductor layer with a barrier dopant; removing the first masking layer; forming a second spacer layer over the second masking layer, wherein the second spacer layer fills the notch; and doping the first portion of the semiconductor layer.
地址 Armonk NY US