PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要
The present invention provides a printed circuit board and a manufacturing method thereof. According to an embodiment of the present invention, the printed circuit board of which a seed layer in a circuit pattern includes etching grooves on both sides thereof, protects the line width of a circuit pattern and prevents undercut.
申请公布号
KR101482429(B1)
申请公布日期
2015.01.13
申请号
KR20130095477
申请日期
2013.08.12
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
HAN, SUNG;KWEON YOUNG DO;BAEK, SEUNG MIN;KIM, YOON SU;LEE, YOUNG JAE
