| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board and its manufacturing method that has excellent high-frequency characteristics and noise-resistant properties as compared with conventional technique. SOLUTION: This multilayer wiring board is equipped with a middle wiring layer that has a signal pattern 1, an upper-side shielding layer that is formed at the upper side of the middle wiring layer via an insulating layer 2 and has an upper-side shielding part 13 that is positioned at the upper part of the signal pattern 1, and a lower-side shielding layer that is formed at the lower side of the middle wiring layer via an insulating layer 3 and has a lower-side shielding part 14 that is positioned at the lower part of the signal pattern 1. In this case, at the lower part of both the sides of the signal pattern 1, a lower- side metal wall 16 that is erected from the lower-side shielding part, and an upper-side shielding wall 15 that is erected at the upper part of the lower-side metal wall 16, are provided, and the upper-side shielding part 13 is conductively connected to the lower-side one 14 for forming a cylindrical shielding part 10. |
