发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiping board and its manufacturing method that prevent electronic components incorporated into an insulating board from being easily affected by an external electromagnetic wave, at the same time, can reduce influence by noise generated by a circuit being composed of the electronic components, and can stabilize electric characteristics inside the wiring board and continuity with an IC chip or the like that is mounted onto a wiring layer and a first main surface. SOLUTION: In a wiring board 1, on the inner surface of a through hole 8 that is provided on an insulating board (core board) 2 and at the same time incorporates an electronic component 12, a shield layer 10 made of a copper- plated film for shielding the electromagnetic wave is formed, and at the same time a chip capacitor (electronic component) 12 inserted into the through hole 8 is stuck via a resin 16, thus carrying out incorporation into the insulating board 2, and at the same time forming wiring layers 26 and 27 being continuous to electrodes 13 and 14 of the capacitor 12 at the upper and lower parts of the insulating board 2.</p>
申请公布号 JP2002016327(A) 申请公布日期 2002.01.18
申请号 JP20010124970 申请日期 2001.04.23
申请人 NGK SPARK PLUG CO LTD 发明人 KODERA EIJI;OGAWA KOJU
分类号 H05K1/18;H05K1/02;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/18
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