Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layer

摘要

A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module.

主权项

1. A camera module, comprising, in a stacked arrangement:
a body comprising a molding material; a device layer carried by the molding and comprising
an image sensor on carried by the body at an upper surface thereof, anda surface mount device (SMD) carried by the body at the upper surface thereof and laterally adjacent and spaced apart from the image sensor; a dielectric material layer partially covering the image sensor and covering the SMD; a conductive material layer carried within the dielectric material layer and coupling an upper surface of the SMD to an upper surface of the image sensor at a lower surface of the dielectric material layer; an IR glass assembly carried by the dielectric material layer; and a lens assembly carried by the IR glass assembly.