发明名称 |
Enhancing integrity of a high-K gate stack by protecting a liner at the gate bottom during gate head exposure |
摘要 |
Sophisticated gate stacks including a high-k dielectric material and a metal-containing electrode material may be covered by a protection liner, such as a silicon nitride liner, which may be maintained throughout the entire manufacturing sequence at the bottom of the gate stacks. For this purpose, a mask material may be applied prior to removing cap materials and spacer layers that may be used for encapsulating the gate stacks during the selective epitaxial growth of a strain-inducing semiconductor alloy. Consequently, enhanced integrity may be maintained throughout the entire manufacturing sequence, while at the same time one or more lithography processes may be avoided. |
申请公布号 |
US8932930(B2) |
申请公布日期 |
2015.01.13 |
申请号 |
US201213672800 |
申请日期 |
2012.11.09 |
申请人 |
Advanced Micro Devices, Inc. |
发明人 |
Beyer Sven;Seliger Frank;Grasshoff Gunter |
分类号 |
H01L21/336 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a gate electrode structure of a transistor, the method comprising:
forming a protection liner on sidewalls of a gate stack, said gate stack being formed above a semiconductor layer and comprising a high-k dielectric gate insulation layer, a metal-containing electrode material formed on said high-k dielectric gate insulation layer and a cap layer; forming a mask material above said semiconductor layer so as to cover said protection liner at least at a bottom of said gate stack; removing said cap layer in the presence of said mask material; and forming a semiconductor alloy in said semiconductor layer with an offset from said gate stack that is determined by a spacer structure formed on said protection liner at the sidewalls of said gate stack. |
地址 |
Sunnyvale CA US |