发明名称 Enhancing integrity of a high-K gate stack by protecting a liner at the gate bottom during gate head exposure
摘要 Sophisticated gate stacks including a high-k dielectric material and a metal-containing electrode material may be covered by a protection liner, such as a silicon nitride liner, which may be maintained throughout the entire manufacturing sequence at the bottom of the gate stacks. For this purpose, a mask material may be applied prior to removing cap materials and spacer layers that may be used for encapsulating the gate stacks during the selective epitaxial growth of a strain-inducing semiconductor alloy. Consequently, enhanced integrity may be maintained throughout the entire manufacturing sequence, while at the same time one or more lithography processes may be avoided.
申请公布号 US8932930(B2) 申请公布日期 2015.01.13
申请号 US201213672800 申请日期 2012.11.09
申请人 Advanced Micro Devices, Inc. 发明人 Beyer Sven;Seliger Frank;Grasshoff Gunter
分类号 H01L21/336 主分类号 H01L21/336
代理机构 代理人
主权项 1. A method of forming a gate electrode structure of a transistor, the method comprising: forming a protection liner on sidewalls of a gate stack, said gate stack being formed above a semiconductor layer and comprising a high-k dielectric gate insulation layer, a metal-containing electrode material formed on said high-k dielectric gate insulation layer and a cap layer; forming a mask material above said semiconductor layer so as to cover said protection liner at least at a bottom of said gate stack; removing said cap layer in the presence of said mask material; and forming a semiconductor alloy in said semiconductor layer with an offset from said gate stack that is determined by a spacer structure formed on said protection liner at the sidewalls of said gate stack.
地址 Sunnyvale CA US