Method for producing chip stacks, and a carrier for carrying out the method

摘要

The invention relates to a method for producing chip stacks with the following method sequence:
applying an especially dielectric and/or photostructurable base layer to one carrier side of a carrier which on its carrier side is provided with an adhesively acting adhesion zone and a less adhesively acting support zone, the base layer being applied largely over the entire surface at least to the support zone,building up the chip stacks on the base layer,potting of the chip stacks,detaching the carrier from the base layer.;Moreover the invention relates to a carrier for executing this method.

主权项

1. Method for producing chip stacks comprising the steps of:
providing a carrier having a carrier side, said carrier side having an adhesively-acting adhesive zone and a less-adhesively-acting support zone, applying a base layer to said carrier side of said carrier by at least one of the following: spin coating or spray coating, the base layer being applied primarily to the support zone, building up chip stacks on the base layer, wherein the base layer supports at least partially the chip stacks, detaching the carrier from the base layer.