发明名称 |
Phase change memory and method of fabricating same |
摘要 |
A fine pitch phase change random access memory (“PCRAM”) design and method of fabricating same are disclosed. One embodiment is a phase change memory (“PCM”) cell comprising a spacer defining a rectangular reaction area and a phase change material layer disposed within the reaction area. The PCM cell further comprises a protection layer disposed over the GST film layer and within the area defined by the spacer; and a capping layer disposed over the protection layer and the spacer. |
申请公布号 |
US8932900(B2) |
申请公布日期 |
2015.01.13 |
申请号 |
US201113216369 |
申请日期 |
2011.08.24 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Tsao Tsun-Kai;Shen Ming-Huei;Liu Shih-Chang;Tu Yeur-Luen;Tsai Chia-Shiung |
分类号 |
H01L21/8239;H01L45/00 |
主分类号 |
H01L21/8239 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A method of fabricating a phase change memory (“PCM”) device comprising an interlayer dielectric (“ILD”) layer having electrodes disposed at opposite ends thereof, the method comprising:
defining a first area on a top surface of the ILD layer using a hard mask; creating a spacer along an inner edge of the hard mask layer and an outer edge of the first area to define a second area; depositing a phase change material layer within the second area; depositing a protection layer over the phase change material layer; isolating the phase change material layer; and depositing a capping layer over the device. |
地址 |
Hsin-Chu TW |