发明名称 Phase change memory and method of fabricating same
摘要 A fine pitch phase change random access memory (“PCRAM”) design and method of fabricating same are disclosed. One embodiment is a phase change memory (“PCM”) cell comprising a spacer defining a rectangular reaction area and a phase change material layer disposed within the reaction area. The PCM cell further comprises a protection layer disposed over the GST film layer and within the area defined by the spacer; and a capping layer disposed over the protection layer and the spacer.
申请公布号 US8932900(B2) 申请公布日期 2015.01.13
申请号 US201113216369 申请日期 2011.08.24
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Tsao Tsun-Kai;Shen Ming-Huei;Liu Shih-Chang;Tu Yeur-Luen;Tsai Chia-Shiung
分类号 H01L21/8239;H01L45/00 主分类号 H01L21/8239
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A method of fabricating a phase change memory (“PCM”) device comprising an interlayer dielectric (“ILD”) layer having electrodes disposed at opposite ends thereof, the method comprising: defining a first area on a top surface of the ILD layer using a hard mask; creating a spacer along an inner edge of the hard mask layer and an outer edge of the first area to define a second area; depositing a phase change material layer within the second area; depositing a protection layer over the phase change material layer; isolating the phase change material layer; and depositing a capping layer over the device.
地址 Hsin-Chu TW