发明名称 Methods for laser cutting glass substrates
摘要 A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate.
申请公布号 US8932510(B2) 申请公布日期 2015.01.13
申请号 US201012824609 申请日期 2010.06.28
申请人 Corning Incorporated 发明人 Li Xinghua;Moore Lisa Anne
分类号 B23K26/00;C03B33/09;B23K26/40;C03C23/00 主分类号 B23K26/00
代理机构 代理人 Haran John T.
主权项 1. A method of cutting a glass article from a strengthened glass substrate comprising a surface compression layer and a tensile layer, the method comprising: forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate; and propagating a through vent through the surface compression and tensile layers at the edge defect by creating a tensile stress field within the strengthened glass substrate that is present from the first edge to a second edge of the strengthened glass substrate along an entire length of a cut line, wherein the tensile stress field is formed by scanning a laser beam back and forth along the entire length of the cut line on the surface compression layer at a scanning speed equal to or greater than 0.5 m/s, the tensile stress field is perpendicular to the cut line, and the through vent precedes a region of separation along the cut line between the glass article and the strengthened glass substrate.
地址 Corning NY US