发明名称 |
Methods for laser cutting glass substrates |
摘要 |
A method for cutting a glass article from a strengthened glass substrate having a surface compression layer and a tensile layer includes forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate. The method further includes propagating a through vent through the surface compression and tensile layers at the edge defect. The through vent precedes a region of separation along a cut line between the glass article and the strengthened glass substrate. |
申请公布号 |
US8932510(B2) |
申请公布日期 |
2015.01.13 |
申请号 |
US201012824609 |
申请日期 |
2010.06.28 |
申请人 |
Corning Incorporated |
发明人 |
Li Xinghua;Moore Lisa Anne |
分类号 |
B23K26/00;C03B33/09;B23K26/40;C03C23/00 |
主分类号 |
B23K26/00 |
代理机构 |
|
代理人 |
Haran John T. |
主权项 |
1. A method of cutting a glass article from a strengthened glass substrate comprising a surface compression layer and a tensile layer, the method comprising:
forming an edge defect in the surface compression layer on a first edge of the strengthened glass substrate; and propagating a through vent through the surface compression and tensile layers at the edge defect by creating a tensile stress field within the strengthened glass substrate that is present from the first edge to a second edge of the strengthened glass substrate along an entire length of a cut line, wherein the tensile stress field is formed by scanning a laser beam back and forth along the entire length of the cut line on the surface compression layer at a scanning speed equal to or greater than 0.5 m/s, the tensile stress field is perpendicular to the cut line, and the through vent precedes a region of separation along the cut line between the glass article and the strengthened glass substrate. |
地址 |
Corning NY US |