| 摘要 |
<p>An alkali etching fluid for solar cell production, including (A) a compound indicated in general formula [1], disulfonic acid, or a salt of either, (B) an alkali compound, and (C) water; and a production method for a silicon-based substrate for solar cell production, characterized by using the etching fluid and etching a wafer having silicon as the main component thereof, and by forming an uneven structure on the surface of the wafer. (In the formula, the p number of R1 each independently indicate a hydrogen atom, a hydroxyl group, or a C1-10 alkyl group, the q number of M each independently indicate a hydrogen atom, an alkali metal atom, an ammonium (NH4) group, or a tetraalkyl ammonium (R24N) group (in the formula, R2 indicates a C1-4 alkyl group), n indicates 0 or 1, and p and q each independently indicate 1 or 2.)</p> |
