| 摘要 |
The invention pertains to a device for signature adaptation, comprising a surface element arranged to assume a determined thermal distribution, wherein said surface element comprises at least one temperature generating element arranged to generate at least one predetermined temperature gradient to a portion of a first heat conducting layer of said surface element, characterized in that said device for signature adaptation comprises a liquid cooling element arranged to provide at least one liquid flow, thermally contacting an inner portion of said at least one temperature generating element so that thermal energy is dispersed from said at least one temperature generating element. |
