| 摘要 |
FIELD: instrument engineering.SUBSTANCE: feed-through plate consists of an outer housing in which at least one non-metallised insulator is mounted, inside which one or more current leads are placed, and between each current lead and each insulator, each insulator and the outer housing the gaps are formed filled by capillary flow by active copper-titanium soldering, by which all elements of the feed-through plate are connected. The current lead is made in the form of a hollow tube with the central contact placed and tightly connected to it, at that on the opposite side of receipt of the solder in the outer housing and the insulator the annular grooves are made, which diameter is greater than the internal diameters of the outer housing and the insulator, made of materials, which temperature coefficients of linear expansion are close to the temperature coefficient of linear expansion of the solder.EFFECT: possibility of obtaining the reliable solder joint, simplification of design of the feed-through plate with simplification of technological process of manufacturing.1 dwg |
