| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent welding brazing agent from creeping up. SOLUTION: A material or a foundation plating layer of a contact for an electronic component is constituted with low-wettability matter of welding brazing agent, on the surface of which, a finishing plating layer is formed constituted with high-wettability matter of the welding brazing agent. Then, a region is formed where a low-wettability material surface or a foundation plating layer surface is exposed, by selectively removing a part of region of the high- wettability finishing plating layer, and this exposed region is used as one for preventing heated and melted welding brazing agent from creeping and moving up along the high-wettability finishing plating layer.</p> |
