发明名称 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
摘要 <p>A plasma processing method of one embodiment of the present invention is disclosed for growing a polycrystalline silicon layer on a base material to be processed. The plasma processing method includes: (a) a step for preparing, in a processing container, the base material to be processed; and (b) a step for growing the polycrystalline silicon layer on the base material by introducing microwaves for plasma excitation into the processing container, and introducing a silicon-containing raw material gas into the processing container.</p>
申请公布号 KR20150003756(A) 申请公布日期 2015.01.09
申请号 KR20147029714 申请日期 2013.04.23
申请人 TOKYO ELECTRON LIMITED 发明人 HONDA MINORU;NAKANISHI TOSHIO;KATAYAMA DAISUKE
分类号 H01L21/205;C23C16/24;C23C16/511;H05H1/46 主分类号 H01L21/205
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