BONDED WAFER EDGE PROTECTION SCHEME

摘要

The present invention relates to a bonded wafer edge protection scheme which comprises the steps of: fixing the bonded wafer by a wafer fixing module; and filling a gap between the bonded wafers with a protection material along an edge. The bonded wafer edge protection scheme according to the present invention additionally comprises the steps of: preheating the bonded wafers; and rotating the bonded wafers by the wafer fixing module.