发明名称 METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT DEVICE USING HYBRID HEAVY COPPER PRINTED CIRCUIT BOARD AND THE ELECTRONIC CIRCUIT DEVICE MANUFACUTED BY USING THE SAME
摘要 <p>The present invention relates to a method to manufacture a hybrid heavy copper printed circuit board including a high current area and a low current area and, more specifically, to a method to manufacture an electronic circuit device for vehicle using a hybrid heavy copper printed circuit board including a high current area and a low current area and to the electronic circuit device for vehicle manufactured by using the same. The present invention easily controls the thickness of a circuit pattern for high current and a circuit pattern for low current and is able to simplify the manufacturing process of the electronic circuit device by: forming a high current area and a low current area by compressing and polishing a partial area of a copper disc, manufactured to a thickness corresponding to the control of high current through a molding process, by any one process selected among a press process, a forging process, a rolling process, and a polishing process; and manufacturing the electronic circuit device for vehicle (for example, a junction box for vehicle, an LED lamp device, etc.) by using a printed circuit board manufactured by attaching the copper disc, in which the high current area and the low current area are formed, to an insulating substrate.</p>
申请公布号 KR101480677(B1) 申请公布日期 2015.01.09
申请号 KR20130141716 申请日期 2013.11.20
申请人 发明人
分类号 H05K3/26 主分类号 H05K3/26
代理机构 代理人
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