COOLING DEVICE AND ELECTRONIC EQUIPMENT HAVING THE COOLING DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a cooling device, capable of conducting heat from a heat- generating body to a heat sink efficiently, while absorbing dimensional tolerance in a thermal connection part between the heat-generating body and the heat sink. SOLUTION: A cooling device 23 is provided with a heat sink 24 facing a heat-generating IC chip 17, a heat-diffusing member 45 provided between the IC chip and the heat sink, a first heat conducting member 56 provided in a clearance S1 between the IC chip and the heat-diffusing member, and a second heat conducting member 57 provided in a clearance S2 between the heat diffusing member and the heat sink. The clearance between the IC chip and the heat diffusing member is set, so as to be narrower than the clearance between the heat diffusing member and the heat sink. The heat-diffusing member is superior in thermal conductivity than the second heat conducting member, and is larger than the IC chip.