SINGULATON OF LIGHT EMITTING DEVICES BEFORE AND AFTER APPLICATION OF PHOSPHOR

摘要

A two-stage singulation process is used in the fabrication of phosphor coated light emitting elements. Prior to the application of the phosphor coating, the individual light emitting elements are singulated using a laser dicing process (130); after application of the phosphor coating (150), the phosphor coated light emitting elements are singulated using a mechanical dicing process (180). Before laser dicing of the light emitting elements, the wafer is positioned on a piece of dicing- or die-attach-tape held by a frame; after laser dicing, the tape is stretched (140) to provide space between the individual light emitting elements that allows for the wider kerf width of the subsequent mechanical dicing (180) after application of the phosphor coating (150).

主权项

1. A method comprising:
mounting a wafer comprising a plurality of light emitting elements each having a top surface opposite a bottom surface, wherein the bottom surface is connected to a stretchable film; dicing the wafer to singulate the light emitting elements; after dicing the wafer stretching the stretchable film to provide space between each of the light emitting elements; after stretching the stretchable film disposing a filler material in the space between the light emitting elements; after disposing the filler material coating the light emitting elements with a wavelength conversion material to provide a sheet of phosphor coated light emitting elements; and after coating the light emitting elements dicing the sheet to singulate the phosphor coated light emitting elements.