发明名称 METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER
摘要 A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
申请公布号 US2015007933(A1) 申请公布日期 2015.01.08
申请号 US201414312679 申请日期 2014.06.23
申请人 Sanmina Corporation 发明人 Iketani Shinichi;Kersten Dale
分类号 H05K3/26;H05K3/42;H05K3/00;H05K1/05;H05K1/03 主分类号 H05K3/26
代理机构 代理人
主权项 1. A core or sub-composite structure, comprising: a first conductive film including a peelable or removable first cover layer formed on or coupled to a first surface of a first conductive layer; and a dielectric layer coupled to a second surface of the first conductive layer of the first conductive film.
地址 San Jose CA US