发明名称 |
METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER |
摘要 |
A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer. |
申请公布号 |
US2015007933(A1) |
申请公布日期 |
2015.01.08 |
申请号 |
US201414312679 |
申请日期 |
2014.06.23 |
申请人 |
Sanmina Corporation |
发明人 |
Iketani Shinichi;Kersten Dale |
分类号 |
H05K3/26;H05K3/42;H05K3/00;H05K1/05;H05K1/03 |
主分类号 |
H05K3/26 |
代理机构 |
|
代理人 |
|
主权项 |
1. A core or sub-composite structure, comprising:
a first conductive film including a peelable or removable first cover layer formed on or coupled to a first surface of a first conductive layer; and a dielectric layer coupled to a second surface of the first conductive layer of the first conductive film. |
地址 |
San Jose CA US |