发明名称 FILLER FOR EPOXY RESIN, AND EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a filler for epoxy resins which filler causes considerably little combination and coagulation with one another among silica particles in spite of being subjected to the treatment with a silane coupling agent. SOLUTION: The filler for epoxy resins is characterized in that a superfine silica powder, which has an average particle diameter D50 of 0.3μm or less, a 10% nominal diameter D100 of 0.5μm or less and a silanol group concentration of 0.5-5.0/nm<2> and forms no substantial structure constitution, is surface- treated with a silane coupling agent; the epoxy resin composition is formed by filling this filler.
申请公布号 JP2002275356(A) 申请公布日期 2002.09.25
申请号 JP20010082537 申请日期 2001.03.22
申请人 DENKI KAGAKU KOGYO KK 发明人 YOSHIDA MASAYA;YOSHIDA AKIO;WATANABE SHOJIRO
分类号 C01B33/18;C08K9/06;C08L63/00;(IPC1-7):C08L63/00 主分类号 C01B33/18
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