发明名称 |
FILLER FOR EPOXY RESIN, AND EPOXY RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a filler for epoxy resins which filler causes considerably little combination and coagulation with one another among silica particles in spite of being subjected to the treatment with a silane coupling agent. SOLUTION: The filler for epoxy resins is characterized in that a superfine silica powder, which has an average particle diameter D50 of 0.3μm or less, a 10% nominal diameter D100 of 0.5μm or less and a silanol group concentration of 0.5-5.0/nm<2> and forms no substantial structure constitution, is surface- treated with a silane coupling agent; the epoxy resin composition is formed by filling this filler.
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申请公布号 |
JP2002275356(A) |
申请公布日期 |
2002.09.25 |
申请号 |
JP20010082537 |
申请日期 |
2001.03.22 |
申请人 |
DENKI KAGAKU KOGYO KK |
发明人 |
YOSHIDA MASAYA;YOSHIDA AKIO;WATANABE SHOJIRO |
分类号 |
C01B33/18;C08K9/06;C08L63/00;(IPC1-7):C08L63/00 |
主分类号 |
C01B33/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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