| 摘要 |
<p>The present invention relates to a water-soluble organic and inorganic composite sol, which is used as a high heat radiation and insulation material, has a little amount of surfactant and organic binders and is manufactured by the polymerization and hydrolysis of an acid catalyst in which thixotropic acid alumina sol is mixed with alkylsilane, and to a manufacturing method thereof. In the present invention, the conductivity and voltage resistance of the composite sole are respectively 0.45-0.63 W/mK and 5.2-6.7 kV/ mm, and the conductivity of the composite sole is two or three times higher than that of epoxy and a silicon resin used as an a matrix binder of an existing heat radiation material. Therefore, the composite sole mixed with inorganic fillers can be used as a high heat radiation and insulation material and applied in M-PCB, LED, a heat radiation plate and a thermal gap filler.</p> |
