| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device that can make the depression of the projecting electrode and lead uniform by restricting deformation of a bonding stage.SOLUTION: A bonding device 101 that pressure-bonds the projecting electrode 111 of a semiconductor chip 110 and the lead 112 under the application of heat; a stage 104 formed of low-heat-expansion ceramic formed of a composite of a positive expansion material, which expands with a temperature increase, and a negative expansion material, which contracts with a temperature increase; and a bonding tool 105, which is heated to a predetermined temperature and which presses the projecting electrode 111 and lead 112 superposed on the stage 104. The negative expansion material is made of phosphoric acid tungstic acid zirconium, and the Young's modulus of the low-heat-expansion ceramic is 85 GPa or greater. |
