| 摘要 |
PROBLEM TO BE SOLVED: To apply coating resin with ease, check the state of the coating with ease, and prevent the occurrence of uncoated areas. SOLUTION: With respect to a semiconductor device 11, a projection 15a is formed on the upper face of the electrode block 15 thereof placed on one 13 of heat sinks, and a recess 14b to be engaged with the projection 15a is formed on the lower face of the other 14 of the heat sinks. Coating resin 17 is applied to faces of the heat sinks 13 and 14 and the like to be brought into contact with resin 18 to enhance the adhesion to the resin 18. Thus, even if the coating resin is applied before the other heat sink 14 is joined with the electrode block 15, some areas are prevented from being left uncoated. |
