发明名称 ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME
摘要 Provided are an electronic device and a fabrication method thereof. The electronic device according to the concept of the present invention includes auxiliary interconnections disposed on a substrate, a light extraction layer that is provided on the substrate and fills between the auxiliary interconnection, and a first electrode provided on the auxiliary interconnections and the light extraction layer, wherein the light extraction layer may have a first surface facing the substrate and a second surface opposite to the first surface, the first surface may have protrusions, and the auxiliary interconnections may include a material having a lower resistance than the first electrode. Since electrical properties of the electronic device are improved, uniform light emission characteristics may be realized.
申请公布号 US2015008401(A1) 申请公布日期 2015.01.08
申请号 US201414269609 申请日期 2014.05.05
申请人 Electronics and Telecommunications Research Institute ;Korea Electrotechnology Research Institute ;Korea Institute of Machinery & Materials 发明人 LEE Jeong Ik;LEE Jonghee;CHO Doo-Hee;HAN Jun-Han;LEE Geon-Woong;HAN Joong-Tak;KIM Do-Geun;JUNG Sunghoon
分类号 H01L51/52;H01L51/56 主分类号 H01L51/52
代理机构 代理人
主权项 1. A method of fabricating an electronic device, the method comprising: providing a supporting substrate in which auxiliary interconnections are formed; forming a light extraction layer on the substrate, wherein light extraction layer fills between the auxiliary interconnections and has a first surface and a second surface that is opposite to the first surface and faces the supporting substrate; forming a substrate on the first surface of the light extraction layer; removing the supporting substrate to expose the second surface of the light extraction layer; and sequentially forming a first electrode, an intermediate layer, and a second electrode on the second surface of the light extraction layer.
地址 Daejeon KR