| 摘要 |
The present invention relates to a method for bonding a first at least partly metallic contact area of a first substrate (1, 1') with a second at least partly metallic contact area of a second substrate with the following steps, more particularly the following sequence: - applying to at least one of the contact areas a sacrificial layer (4) which is soluble at least partly, more particularly predominantly, in the material of at least one of the contact areas, - bonding the contact areas with at least partial dissolution of the sacrificial layer (4) in at least one of the contact areas. The contact areas can be arranged over the whole area on a bonding region (3). Alternatively, the contact areas can be formed from a plurality of bonding regions (3') which are surrounded by bulk material (5) or arranged in substrate cavities (2). A liquid (e.g. water) can be used to produce a pre-bond between the substrates. |
