THIN FILM LED DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A thin film LED device and manufacturing method thereof are provided. The LED device comprises a slice-type circuit board (1), a flip structure LED chip (2) without gold wires and a light transmission protecting film (3). Chip electrodes (21, 22) of the LED chip (2) are fixed on the slice-type board by eutectic welding way. An electric connection without gold wire bonding is achieved. The light transmission protecting film (3) covers on the surface of the chip (2) and the circuit board (1). Electrodes of the LED device are positioned at the bottom of the device for realizing the surface mount technology easily. The thickness of the LED device is between 0.25-0.6 mm. The LED device has the advantages of thin thickness, small size, large light-emitting angle, high light efficiency, high reliability, simple manufacturing process, low cost and the like, is suitable for high-power and common-power LED packaging, and can be widely applied in the fields of illumination, display and the like.