| 发明名称 |
INSULATOR FILM FOR PRINTED-CIRCUIT BOARD, AND PRODUCT USING THE SAME |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an insulator film for a printed-circuit board having low thermal expansion coefficient and high peel strength characteristics, and a product using the same.SOLUTION: An insulator film 131 for a printed-circuit board comprises: a core layer 10; and primer layers 20 laminated on opposite sides of the core layer 10 and containing a polyamide-imide resin.</p> |
| 申请公布号 |
JP2015005712(A) |
申请公布日期 |
2015.01.08 |
| 申请号 |
JP20130176734 |
申请日期 |
2013.08.28 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
KIM JINYOUNG;JO DAI HWI;YOO SEONG HYUN;LEE HYUN JUN;MOON JIN SEOK;YOON GUM HWI |
| 分类号 |
H05K1/03;B32B27/34;C08J5/24;C08K3/00;C08K5/3415;C08L63/00;C08L67/03;H05K3/46 |
主分类号 |
H05K1/03 |
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