| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin composition for sealing an optical semiconductor element, which gives a cured product excellent in heat resistance, UV resistance, and curability.SOLUTION: The resin composition for sealing an optical semiconductor element contains: (A) an organopolysiloxane which has a C6-C12 monovalent aromatic hydrocarbon group, a silalkylene group, and a branched structure comprising an organopolysiloxane; (B) a compound having at least one carboxylic acid anhydride group in one molecule; (C) an organopolysiloxane containing an alicyclic epoxy group; (D) a curing catalyst; and (E) an antioxidant.</p> |
