| 摘要 |
The present invention relates to a die interconnect system, comprising a first die (1) having a plurality of connection pads (3), and at least one interconnect (10,20) extending from the first die (1), the interconnect having a plurality of metal cores (12,42) with a core diameter, and a dielectric layer (15,43) surrounding the metal cores (12,42) with a dielectric thickness, with at least a portion of dielectric layer (15, 43) surrounding adjacent metal cores (12,42) along the length of the plurality of metal cores (12,42), and an outer metal layer (41) attached to ground. |
