HYBRID BARRIER LAYER FOR SUBSTRATES AND ELECTRONIC DEVICES

摘要

Systems and techniques for depositing multiple different organic precursors, with reactive gases, such as by plasma polymerization, are provided. Using multiple precursor materials may provide for a much larger process regime, thus enabling for precise tuning of barrier properties and stress of the films. A barrier film as disclosed herein may be used on variety of substrates and electronic devices to reduce the permeation of moisture and other atmospheric contaminants.