| 摘要 |
The present invention relates to a chemical-mechanical polishing apparatus having a retainer ring. The chemical-mechanical polishing apparatus according to the present invention includes: a polishing pad; a polishing head including a membrane being in contact with a wafer located on the polishing pad upon polishing; and the retainer ring installed around the membrane to prevent separation of the wafer upon the polishing. The retainer ring includes an upper retainer member assembled with the polishing head and a lower retainer member locked with the upper retainer member. The retainer ring includes an auxiliary separation prevention part installed therein to prevent separation of the wafer upon polishing. The auxiliary separation prevention part may include an inclined bottom part which is upward-inclined from an inward direction close to the membrane to an outward direction to locally pressurize pressure to a part close to the wafer among bottom parts of the lower retainer member. The auxiliary separation prevention part may include a local pressure applying part installed on an inner periphery of the lower retainer member and formed therein with a groove in which gas is injected to locally apply pressure to a part close to the wafer among bottom parts of the lower retainer member by the polishing head. |
