SEMICONDUCTOR DEVICE

摘要

To reinforce power supply wirings without sacrificing the interconnectivity of semiconductor devices. When three wirings are formed in parallel in the same wiring layer and the center wiring among them is shorter than the outer wirings, a projecting portion integrated into the outer wiring is formed utilizing a free space remaining on the extension of the center wiring. For example, when the outer wirings are used as power supply wirings, the power supply wirings can be reinforced by adding the projecting portion. At this time, because the projecting portion is arranged in the free space, the interconnectivity is not sacrificed.

主权项

1. A semiconductor device, comprising:
a first wiring arranged in a first wiring layer; a second wiring arranged in the first wiring layer; a third wiring arranged in the first wiring layer between the first and second wirings; a first projecting portion integrally formed with the first wiring between the first and second wirings in the first wiring layer; a fourth wiring arranged in a second wiring layer, the fourth wiring intersecting with the first wiring and the first projecting portion; a first via coupling between the first wiring and the fourth wiring; and a second via coupling between the first projecting portion and the fourth wiring.