| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost and highly reliable packaging method for an MEMS device.SOLUTION: In a method of packaging a Micro-Electro-Mechanical System (MEMS) device, an interposer board having a first surface 104 and a second surface 106 on the opposite side, which is an interposer board 102 having a plurality of electric contact points 108, is prepared on the second surface. A plurality of shim layers 112 are adhered onto the first surface of the interposer board, and a plurality of MEMS dies 120 are adhered onto each of the shim layers in a separated manner. Each of the MEMS dies is electrically connected to the interposer board by wire bonding. In order to manufacture a packaged MEMS device, a plurality of covers 130 cover each of the MEMS dies, and are attached to the first surface of the interposer board. Each of the MEMS dies exists in a hermetically sealed cavity defined by each one of the covers, and substantially isolated from thermal stress. |
