发明名称 ELECTRONIC COMPONENT UNIT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an electronic component unit that enables manufacture at low costs, is lightweight and is highly waterproof, and a manufacturing method thereof. ! SOLUTION: An electronic component unit 1 comprises an electronic component 2, and a resin sealing member 3 covering it. The resin sealing member 3 is made from foam resin which is formed by foaming thermoplastic resin. In a long-diameter size distribution of connection holes connecting foam cells of the foam resin, the average value αμm and standard deviation σμm of the long-diameter sizes satisfy the relation of α+3σ≤500. To manufacture the electronic component unit, the electronic component is coated with a mixture of a first raw material liquid and a second raw material liquid, which are materials for thermoplastic resin composing the resin sealing member 3. The thermoplastic resin is cured while foamed. During the mixing of the first and second raw material liquids, the first raw material liquid is heated to decrease i
申请公布号 JP2015005725(A) 申请公布日期 2015.01.08
申请号 JP20140078456 申请日期 2014.04.07
申请人 DENSO CORP 发明人 ECHIGO SUSUMU ; YOSHIDA AKIKAZU ; ARAO OSAMU
分类号 H01L23/29;B29B7/76;B29C31/10;B29C39/10;B29C39/12;H01L21/56;H01L23/31;H05K3/28 主分类号 H01L23/29
代理机构 代理人
主权项
地址