| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which enables assuring of insulation property when used at a high voltage and enables decreasing of heat resistance. ! SOLUTION: In a semiconductor device, which has a structure in which a first heat diffusion layer 6 is sandwiched between insulating layers 5, 7, or first and second layers, the two layers, or the insulating layers 5, 7 assure electrical insulation property when used at a high voltage, and further, the first heat diffusion layer 6 promotes heat diffusion in the direction along surfaces of the layers 5-6 for reducing heat resistance. ! COPYRIGHT: (C)2015,JPO&INPIT |
