| 摘要 |
<p>The present invention relates to a substrate processing apparatus which includes a bottom electrode which includes embossing parts on the upper side thereof and a damp part with a preset width and a preset height which is formed around the upper side thereof. Lift pin through holes are formed on the inner side of the damp part which is formed around the edge of the bottom electrode with a preset space. The edge of a substrate is cooled by supplying helium gas through the lift pin through hole. Thereby, the present invention prevents photoresist burning by uniformly cooling the edge of the substrate.</p> |
