| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition for electronic components which can be cured quickly, and also can improve the moist heat resistance of a cured product. ! SOLUTION: A curable composition for electronic components according to the present invention comprises an epoxy compound not having a radical-polymerizable group, a curable compound having an epoxy group and a radical-polymerizable group, a latent epoxy curing agent, a photo- or thermal-radical polymerization agent, and a compound having two or more thiol groups. ! COPYRIGHT: (C)2015,JPO&INPIT |
