发明名称 Electronic Device
摘要 According to one embodiment, electronic device includes first board, second board, first component, and second component. The first board includes first and second faces and to which opening and cutout portion is provided. The opening penetrates through the first board. The cutout portion extends to side separating from center of the opening at edge of the opening. The second board includes third and fourth faces. The second board overlaps the first board and is electrically connected to the first board in state in which the fourth face and the first face face each other. The second board covers the opening. The first electronic component is provided to the third face, and electrically connected to the second board. The second component is provided to the fourth face and electrically connected to the second board in state in which at least portion of the second component is held in the opening.
申请公布号 US2015009609(A1) 申请公布日期 2015.01.08
申请号 US201414250189 申请日期 2014.04.10
申请人 Kabushiki Kaisha Toshiba 发明人 Sugai Takahiro
分类号 G06F1/16 主分类号 G06F1/16
代理机构 代理人
主权项 1. An electronic device comprising: a first circuit board comprising a first face and a second face opposite the first face and to which an opening and a cutout portion is provided, the opening penetrating through the first circuit board between the first face and the second face, the cutout portion extending to a side separating from a center of the opening at an edge of the opening; a second circuit board comprising a third face and a fourth face opposite the third face, the second circuit board overlapping the first circuit board and being electrically connected to the first circuit board in a state in which the fourth face and the first face face each other, the second circuit board covering the opening; a first electronic component provided to the third face, and electrically connected to the second circuit board; and a second electronic component provided to the fourth face and electrically connected to the second circuit board in a state in which at least a portion of the second electronic component is held in the opening.
地址 Tokyo JP
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