WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces.

主权项

1. A wiring board comprising:
a support board; a variable wettability layer situated on a top surface of the support board and containing a material having a critical surface tension that changes by energy given thereto; and a conductive layer situated inside a concave portion formed in the variable wettability layer, wherein said concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between said side walls is reduced toward a bottom of said concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of said conductive layer, and upper edges of said side walls are formed in smooth curved surfaces.