发明名称 HIGH THERMAL CONDUCTIVITY THERMOPLASTIC RESIN COMPOSITION WITH EXCELLENT INJECTION MOLDABILITY
摘要 This high thermal conductivity thermoplastic resin composition contains (A) to (C), specifically, contains 20-200 parts by weight of (B) and 20-250 parts by weight of (C) per 100 parts by weight of (A), (A) being a thermoplastic polyester resin having a weight-average molecular weight of 50,000-200,000, (B) being a polyalkylene terephthalate block copolymer comprising polyether segments, and polyethylene terephthalate segments which have ethylene terephthalate units as the main constituent component, and (C) being a high thermal conductivity inorganic compound.
申请公布号 WO2015002198(A1) 申请公布日期 2015.01.08
申请号 WO2014JP67550 申请日期 2014.07.01
申请人 KANEKA CORPORATION 发明人 NONOMURA, ASATO;UCHIDA, SOICHI;NODA, YASUSHI
分类号 C08L67/00;C08J5/00;C08K3/00 主分类号 C08L67/00
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