发明名称 WAFER-SUPPORT MOUNTS AND CHEMICAL VAPOR DEPOSITION DEVICE USING SAID WAFER-SUPPORT MOUNTS
摘要 <p>Each of these wafer-support mounts (7), which are used in a CVD device (1) that forms layers on wafers (W), has a wafer placement surface (7a) in the center of the top surface thereof and a wafer-support section (7b) surrounding same. Each wafer-support section (7b) has the following: vertical wafer-support side surfaces (7b1) that encircle the side surfaces of the wafer placed there; and a surrounding top surface that includes downwardly sloped surfaces (7b2) that slope downwards in the radially outwards direction from the top edges of the wafer-support side surfaces so as to encircle same.</p>
申请公布号 WO2015001975(A1) 申请公布日期 2015.01.08
申请号 WO2014JP66317 申请日期 2014.06.19
申请人 SHOWA DENKO K.K. 发明人 FUKADA KEISUKE;MOMOSE KENJI
分类号 H01L21/31;C23C16/458;H01L21/683 主分类号 H01L21/31
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