PACKAGE SUBSTRATE, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a package substrate and a manufacturing method therefor, capable of increasing a transmission speed between electronic components.SOLUTION: A package substrate 10 includes an outermost conductor layer 158Fb including pads 76FP, 76SP for mounting the electronic components. A first conductor layer 158Fa including a plurality of first conductor circuits is formed beneath an outermost interlayer resin insulation layer. The first conductor layer 158Fa functions as a dedicated wiring layer for transmitting data between the electronic components.